In the technology gold rush sparked by artificial intelligence, The University of Texas at Austin stays ahead of the curve with support from some of the world’s leading hardware and software companies. During 2024 — UT’s Year of AI — the University has partnered with companies to pursue bold and creative solutions to our world’s most pressing needs, from patient-centered health care to climate resilience. Together we are leading the state’s efforts in semiconductor research and education.
Computing Solutions
“AI has the potential to solve some of the most challenging problems facing humanity,” says Dion Harris, director of accelerated computing at NVIDIA, the company powering Vista. “NVIDIA’s accelerated computing platform equips leading academic supercomputers with the extreme performance required to unlock this transformative potential.”
Dave Lincoln, vice president of Compute Systems and Solutions for Dell Technologies, says, “Stampede3, a Dell Technologies-powered system, will help TACC continue our long history of deploying the latest technologies to enable curiosity and advance society.”
Made in Texas
“Being able to pull from a skilled workforce is of utmost importance for us,” says Samsung Austin Semiconductor President Bonyoung Koo. “That is why we’re investing in the Cockrell School of Engineering.”
By helping to recruit the best and brightest undergraduate and graduate students to study semiconductor manufacturing and other key majors across UT, the partnership will elevate UT’s semiconductor education, innovation and research, and position Texas as a leader in the burgeoning U.S. semiconductor industry.
“Receiving the Samsung Scholarship is an incredible honor and a significant motivator as I continue my academic journey.”
Meeting of the Minds
The Texas Institute for Electronics (TIE) is a UT-supported semiconductor consortium that includes state and local government, national labs, nationally recognized academic institutions, and preeminent defense electronics and semiconductor companies. TIE’s strategic member companies include semiconductor leaders like Advanced Micro Devices Inc., Applied Materials Inc., Intel Corp., Micron Technology Inc., Raytheon, Samsung and Emerson/NI. As a thought leader in this field, UT and TIE will help craft the future of commercial and defense sectors through innovation in workforce development, state-of-the-art fabrication facilities and smaller, faster chip design. TIE was recently awarded $840 million to build a microelectronics manufacturing center for the Department of Defense.
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